
19 Apr 202610 min read
U.S. Semiconductor Supply Chain: Why Chips Go to Taiwan for Packaging
0:00/53.2000831× The hard part of AI chip supply is no longer only the fab. A large share of the delay now sits in advanced packaging, the step that turns separate dies and memory into a usable processor module. That matters because even chips built in the US can still be sent to Taiwan for packaging before they go into servers. As AI demand rises, packaging capacity now affects delivery times, system design, and who gets access to the most advanced chips first. Advanced packaging is now as



